CPU thermal conductive pad

CPU thermal conductive pad 1,Material: silicone 2,Shipment: as customized 3,Color:as customzied 4,MOQ:20pcs

CPU thermal conductive pad

1,LED modules, and South bridges of Mother board, thermal conduction interface of heat sink, automobile heat source components, digital camera, DV, LCD panels, CPU thermal management,

2, Termal conduction interface material between power transistors and heat sinks, hard discs, CD and DVD

devices, video games, lamps, GPS, communication equipments, aerials, base stations, FPC boards, notebooks,

PC, mobile devices, power systems, memory modules, aerospace equipments and others.

3,Features : Supreme flexibility and perfect fitting. Re-workable with high ability to return to original shape.

4,Great thermal conductivity Low possibility of oil leakage makes no damage to other components.

5,Thickness may be adjustable for customer needs.

6,Thickness 0.1-14.0mm

7,Can be cut into various shapes and size according to different components.

8,Designed to provide stable and reliable performance

9,High temperature and high pressure resistant.

10,10 conductivity: 0.8,1.0,1.5,2.0,2.5,3.0

Just for reference as below:

CP-2.5

Test Item	Unit	Data	Test Methord
Spec	mm	200*400(can help to die cut different size)	ASTM D1204
Color	------		Visual
Thickness	mm	0.5~10.0	ASTM D374
Hardness	Shore C	25±5 30±5	ASTM, D2240
Density	g/cc	2.93	ASTM D792
Tensile Strength	KN/m	0.38~0.42	ASTM D412
Elongation	%	72~75	ASTM D412
Continuous Use Temp	°C	-40~150	En344
Breakdown voltage	Kv/mm	≥5.3	ASTM D149
Volume Impedance	Ω.cm	8.2*1016	ASTM D257
Permittivity	@1MHz	6.3	ASTM D150
Weight Damnify	%	≤0.5	@200°C 240H
Flame Rating	-----	V-0	UL 94
Thermal Conductivity	W/m.k	2.5	ASTM E 1461

CPU thermal conductive pad